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 SSG9922E
6.8A, 20V,RDS(ON) 20m[ Elektronische Bauelemente
N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
A suffix of "-C" specifies halogen & lead-free
SOP-8
Description
The SSG9922E provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
6.20 5.80 0.25 0.40 0.90 0.19 0.25
45
o
0.375 REF
3.80 4.00
Features
* Optimal DC/DC Battery Application * Low On-Resistance * Capable Of 2.5V Gate Drive
D1 8 D1 7 D2 6 D2 5
0.35 0.49
1.27Typ. 4.80 5.00 0.100.25
0 o 8
o
1.35 1.75
Dimensions in millimeters
D1
D2
9922ESS
Date Code
G1
G2
1 S1
2 G1
3 S2
4 G2
S1
S2
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS@4.5V Continuous Drain Current , VGS@4.5V Pulsed Drain Current
1 3 3
Symbol
VDS VGS ID@TA=25 C ID@TA=70 C IDM PD@TA=25 C
o o o
Ratings
20
12 6.8 5.4 25 2 0.016
Unit
V V A A A W
W/ C
o o
Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range
Tj, Tstg
-55~+150
C
Thermal Data
Parameter
Thermal Resistance Junction-ambient
3
Symbol
Max. Rthj-a
Ratings
62.5
o
Unit
C /W
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2004 Rev. B
Page 1 of 4
SSG9922E
6.8A, 20V,RDS(ON) 20m[ Elektronische Bauelemente
N-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 oC Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25oC) Drain-Source Leakage Current (Tj=70oC) Static Drain-Source On-Resistance2
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS
Min.
20
_
Typ.
_
Max.
_ _
Unit
V V/ oC V nA uA uA
Test Condition
VGS=0V, ID=250uA Reference to 25oC, ID=1mA VDS=VGS, ID=1mA VGS=12V VDS=20V,VGS=0 VDS=16V,VGS=0 VGS=4.5V, ID=6A VGS=2.5V, ID=4A
0.05
_ _ _ _ _ _
0.5
_ _ _ _
1.2
10
10 100 20 25
40
_ _
RDS(ON) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs Rg
_ _ _ _ _ _ _ _ _ _ _
m[
Total Gate Charge
2
25 3 9 11 12 47 23 1730 280 240 22 2.2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance Gate Resistance
nC
ID=6A VDS=16V VGS=4.5V
_
_ _ _
VDD=15V ID=1A nS VGS=4.5V RG=3.3 [ RD=15 [
2770
_ _
pF
VGS=0V VDS=20V f=1.0MHz
_ _
_ _
S
[
VDS=4.5V, ID=6A f=1.0MHz
Source-Drain Diode
Parameter
Forward On Voltage
2
Symbol
VDS
Min.
_
Typ.
_
Max.
1.2
Unit
V
Test Condition
IS =0.84A , VGS=0V. IS =6A , VGS=0V. dl/dt=100A/us
Reverse Recovery Time
2
Trr Qrr
_ _
24 18
_ _
nS nC
Reverse Recovery Charge
Notes: 1.Pulse width limited by safe operating area. 2.Pulse widthO 300us, dutycycleO2%. 3.Surface mounted on 1 inch2 copper pad of FR4 board; 135OC/W when mounted on min. copper pad.
http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual
01-Jun-2004 Rev. B
Page 2 of 4
SSG9922E
6.8A, 20V,RDS(ON) 20m[ Elektronische Bauelemente
N-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode
http://www.SeCoSGmbH.com/
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
Any changing of specification will not be informed individual
01-Jun-2004 Rev. B
Page 3 of 4
SSG9922E
6.8A, 20V,RDS(ON) 20m[ Elektronische Bauelemente
N-Channel Enhancement Mode Power Mos.FET
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
135 : /W
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2004 Rev. B
Page 4 of 4


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